PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

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PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18672545 titled 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.