METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor(s)

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18669566 titled 'METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

The method described in the patent application involves forming a semiconductor structure by surrounding a die with a dielectric layer, creating recesses, and incorporating light-blocking layers and a photoelectric device.

A die is received and surrounded by a dielectric layer.
A first recess is formed by removing a portion of the dielectric layer.
A first light-blocking layer is placed within the first recess.
A dielectric paste is applied over the first light-blocking layer.
A second recess is formed by removing a portion of the dielectric paste.
A second light-blocking layer is disposed within the second recess.
A photoelectric device is placed over the first and second light-blocking layers.
A redistribution layer is formed over the die, dielectric layer, and photoelectric device.
A third recess is created over the photoelectric device by removing a portion of the redistribution layer.
A light-conducting member is coupled to the photoelectric device through the third recess.

Potential Applications: - Semiconductor manufacturing - Photovoltaic devices - Optoelectronics

Problems Solved: - Enhancing light-blocking capabilities - Improving the efficiency of photoelectric devices

Benefits: - Increased performance of semiconductor structures - Enhanced light management - Improved functionality of photoelectric devices

Commercial Applications: Title: Advanced Semiconductor Structure for Optoelectronic Devices This technology can be utilized in the production of high-performance solar panels, LED lighting systems, and optical sensors, leading to more efficient and reliable optoelectronic devices in various industries.

Questions about the technology: 1. How does the incorporation of light-blocking layers improve the performance of the semiconductor structure? 2. What are the advantages of using a redistribution layer in this method?

Original Abstract Submitted

A method for forming a semiconductor structure includes receiving a die; forming a dielectric layer to surround the die; removing a portion of the dielectric layer to form a first recess; disposing a first light blocking layer within the first recess; applying a dielectric paste over the first light blocking layer; removing a portion of the dielectric paste to form a second recess; disposing a second light blocking layer within the second recess; disposing a photoelectric device over the first light blocking layer and the second light blocking layer; forming a redistribution layer over the die, the dielectric layer and the photoelectric device; removing a portion of the redistribution layer to form a third recess over the photoelectric device; and coupling a light-conducting member to the photoelectric device through the third recess; wherein the second light blocking layer is separated from the first light blocking layer and the photoelectric device.