18667044. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Sang Yeop Kim of Suwon-si (KR)
Beom Joon Cho of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18667044 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component is provided, the multilayer electronic component including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode disposed externally on the body; and a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction, intersecting the first direction, and a linking portion connecting the connection portion and the mounting portion, wherein the linking portion includes an inward portion extending inwardly from one end of the connection portion in the second direction and an outward portion extending outwardly from one end of the inward portion in the second direction, wherein, when an angle formed by the inward portion and the outward portion is defined as θ, the angle θ satisfies 10°≤θ≤150°.
