18665987. Sensor Device And Electronic Apparatus simplified abstract (SEIKO EPSON CORPORATION)
Sensor Device And Electronic Apparatus
Organization Name
Inventor(s)
Masayasu Sakuma of Kamiina (JP)
Yoshihiro Kobayashi of Komagane (JP)
Sensor Device And Electronic Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 18665987 titled 'Sensor Device And Electronic Apparatus
Simplified Explanation:
The patent application describes a sensor device with a mounting member that has fixation surfaces inside. At least one electronic component is fixed to these surfaces, and the mounting member is part of a casing for housing the electronic component. The fixation surfaces are perpendicular to each other.
- The sensor device includes a mounting member with fixation surfaces inside.
- At least one electronic component is fixed to the fixation surfaces.
- The mounting member forms part of a casing for housing the electronic component.
- The fixation surfaces are perpendicular to each other.
Potential Applications: The technology can be used in various industries such as automotive, healthcare, consumer electronics, and industrial manufacturing for sensing and monitoring applications.
Problems Solved: This technology solves the problem of securely mounting electronic components within a casing while ensuring stability and reliability.
Benefits: The benefits of this technology include improved durability, enhanced performance, and simplified assembly processes for sensor devices.
Commercial Applications: Title: "Innovative Sensor Device Technology for Diverse Commercial Applications" This technology can be commercially applied in sectors such as automotive sensors, medical devices, smart home systems, and industrial automation for improved sensing capabilities and product reliability.
Prior Art: Readers can explore prior art related to sensor device mounting techniques, electronic component fixation methods, and casing designs in the field of sensor technology.
Frequently Updated Research: Stay updated on the latest advancements in sensor device technology, electronic component mounting innovations, and casing materials for improved sensor performance.
Questions about Sensor Device Technology: 1. What are the key advantages of using perpendicular fixation surfaces in sensor devices? 2. How does this technology compare to traditional methods of mounting electronic components in sensor devices?
Original Abstract Submitted
A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.