18663749. EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES simplified abstract (Juniper Networks, Inc.)
EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES
Organization Name
Inventor(s)
Domenico Di Mola of Morgan Hill CA (US)
Steven B. Alleston of Los Gatos CA (US)
Jeffery J. Maki of Dublin CA (US)
Chul Soo Park of Dublin CA (US)
Jon J. Anderson of San Jose CA (US)
EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18663749 titled 'EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES
Simplified Explanation:
The sourceless co-packaged optical-electrical chip described in the patent application includes multiple optical transceivers that can transmit to external or internal components. Each transceiver can be set up for different modulation formats, such as pulse amplitude, phase shift key, and quadrature amplitude modulation. Various light sources provide light for processing by the transceivers, which can be configured for different applications and data rates. An optical coupler combines the light for the transceivers using a polarization maintaining media, while another coupler separates the different channels of light for the transceivers based on different co-packaged configurations.
- Multiple optical transceivers with different modulation formats
- Various light sources for different applications and data rates
- Optical coupler combining light for transceivers using polarization maintaining media
- Another coupler separating channels of light for different transceivers
- Sourceless co-packaged optical-electrical chip design
Potential Applications: The technology described in the patent application could be used in telecommunications, data centers, high-speed internet connections, and other optical communication systems.
Problems Solved: This technology addresses the need for efficient and flexible optical communication systems that can handle different modulation formats and data rates.
Benefits: The benefits of this technology include improved performance, flexibility, and scalability in optical communication systems.
Commercial Applications: Title: Advanced Optical Transceiver Technology for High-Speed Data Communication This technology could be commercially applied in telecommunications equipment, data center networking hardware, and high-speed internet infrastructure.
Prior Art: Readers interested in prior art related to this technology could start by researching advancements in optical transceiver technology, modulation formats, and optical communication systems.
Frequently Updated Research: Researchers are continually exploring new ways to enhance optical transceiver technology, improve modulation formats, and optimize optical communication systems.
'Questions about Optical Transceiver Technology: 1. How does the sourceless co-packaged optical-electrical chip improve efficiency in optical communication systems? 2. What are the key advantages of using different modulation formats in optical transceivers?
Original Abstract Submitted
A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.
- Juniper Networks, Inc.
- Domenico Di Mola of Morgan Hill CA (US)
- Steven B. Alleston of Los Gatos CA (US)
- Zhen Qu of Sunnyvale CA (US)
- Ryan Holmes of Nepean (CA)
- Jeffery J. Maki of Dublin CA (US)
- Chul Soo Park of Dublin CA (US)
- Yang Yue of Milpitas CA (US)
- Jon J. Anderson of San Jose CA (US)
- H04B10/2581
- G02B6/42
- H01S5/40
- H04B10/40
- H04B10/50
- H04B10/516
- H04B10/60
- H04J14/04
- CPC H04B10/2581