SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 18663234 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

A semiconductor package may include a first redistribution structure, a first semiconductor die on the first redistribution structure, a second semiconductor die on the front side redistribution structure and side-by-side with the first semiconductor die, a substrate on the front side redistribution structure and surrounding each of the first semiconductor die and the second semiconductor die, a bridge die on the substrate, a second redistribution structure on the substrate and around the bridge die, a third semiconductor die on the second redistribution structure and on the bridge die, and a fourth semiconductor die on the second redistribution structure and on the bridge die.