HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

Organization Name

Inventor(s)

Rui Tanaka of Nagaokakyo-shi, Kyoto (JP)

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18662601 titled 'HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

The abstract of the patent application describes a high-frequency module with a switch circuit that includes multiple signal paths, each containing switching elements that control connections between common terminals and selection terminals. One signal path includes wiring patterns in both the IC chip and the mounting board.

The high-frequency module features a switch circuit with multiple signal paths.
Each signal path includes switching elements that control connections between common and selection terminals.
One signal path includes wiring patterns in both the IC chip and the mounting board.

Potential Applications: - Telecommunications equipment - Wireless communication devices - Radar systems

Problems Solved: - Efficient switching of high-frequency signals - Integration of wiring patterns in IC chips and mounting boards

Benefits: - Improved signal control and routing - Enhanced performance of high-frequency modules - Simplified design and manufacturing processes

Commercial Applications: Title: "Advanced High-Frequency Switching Modules for Telecommunications and Radar Systems" This technology can be utilized in the development of advanced telecommunications equipment, wireless communication devices, and radar systems, enhancing their performance and reliability in high-frequency signal processing.

Questions about the technology: 1. How does the integration of wiring patterns in the IC chip and mounting board improve the performance of the high-frequency module? 2. What are the key advantages of using multiple signal paths with switching elements in a high-frequency module?

Original Abstract Submitted

In a high-frequency module, a plurality of signal paths of a switch circuit include a plurality of switching elements that switch a connection form between a plurality of common terminals and a plurality of selection terminals. At least one signal path among the plurality of signal paths of the switch circuit includes a first wiring pattern portion included in the IC chip, and a second wiring pattern portion included in a mounting board.