18661640. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Seho You of Suwon-si (KR)

Kyungdon Mun of Suwon-si (KR)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 18661640 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

A semiconductor package includes a package substrate including first and second wirings, a logic chip on the package substrate, electrically connected to the first wiring, and including a first wireless communication element, a chip structure on the logic chip, and including a buffer chip containing first and second through-electrodes, a first connection circuit electrically connected to the first through-electrode, and a second connection circuit electrically connected to the second through-electrode, and a plurality of memory chips stacked on the buffer chip and electrically connected to the first and second through-electrodes, a second wireless communication element within the buffer chip or between the buffer chip and the logic chip, electrically connected to the first connection circuit, and coupled to the first wireless communication element, and a plurality of conductive vertical structures between the chip structure and the package substrate and electrically connecting the second connection circuit and the second wiring.