18660617. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18660617 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor chip includes: a substrate; a plurality of upper pads on the substrate, the plurality of upper pads including a first group of the upper pads and a second group of the upper pads; a buffer layer covering a side surface of the first group of the upper pads; and an insulating layer surrounding a side surface of the second group of the upper pads and a side surface of the buffer layer on the substrate, wherein the buffer layer includes a first material having a first Young's modulus smaller than a second Young's modulus of a second material in the plurality of upper pads.