ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18654049 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

An electronic package and a manufacturing method thereof are provided, in which at least one first electronic element, at least one second electronic element and an optical engine module are all disposed or heterogeneously integrated on a first circuit structure and are electrically connected to the first circuit structure. Furthermore, the first circuit structure is disposed on a carrier structure, so that the first circuit structure and the first electronic element, the second electronic element and the optical engine module on the first circuit structure are carried by the carrier structure, and the first electronic element, the second electronic element and the optical engine module are all electrically connected to the carrier structure via the first circuit structure. Therefore, the electronic package can improve data transmission performance, reduce insertion loss/power loss, or reduce the warpage problem.