18653368. CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE (Samsung Electro-Mechanics Co., Ltd.)
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
This abstract first appeared for US patent application 18653368 titled 'CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
Original Abstract Submitted
An embodiment of the present disclosure provides a circuit board including: an insulating layer including a first area on one surface on which an electronic component is mounted and a second area adjacent to the first area; a connection pad disposed in the first area; and a solder resist layer covering the one surface of the insulating layer and being opened to expose the connection pad. At least a portion of the solder resist layer extends from the second area to the first area, and a portion of the insulating layer is exposed from the solder resist layer in the first area.