18650969. IMAGE SENSOR AND FABRICATION METHOD OF THE SAME (Samsung Electronics Co., Ltd.)
IMAGE SENSOR AND FABRICATION METHOD OF THE SAME
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IMAGE SENSOR AND FABRICATION METHOD OF THE SAME
This abstract first appeared for US patent application 18650969 titled 'IMAGE SENSOR AND FABRICATION METHOD OF THE SAME
Original Abstract Submitted
An image sensor is provided. The image sensor includes: a plurality of pixels; a semiconductor substrate including a first surface and a second surface opposing the first surface; a device isolation layer provided in a trench penetrating through the first surface and the second surface of the semiconductor substrate, and separating the plurality of pixels from each other; and a microlens provided on the second surface. The device isolation layer includes: a buried insulating pattern penetrating through the first surface and the second surface; an insulating liner between the buried insulating pattern and the semiconductor substrate; a conductive liner between the insulating liner and the buried insulating pattern; and a buried conductive pattern provided on at least a portion of the buried insulating pattern and contacting the conductive liner.