18640980. APPARATUS FOR PROCESSING A WAFER (Samsung Electronics Co., Ltd.)
APPARATUS FOR PROCESSING A WAFER
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APPARATUS FOR PROCESSING A WAFER
This abstract first appeared for US patent application 18640980 titled 'APPARATUS FOR PROCESSING A WAFER
Original Abstract Submitted
An example apparatus for processing a wafer includes a grinder, a mounter, and a dock. The grinder is configured to grind a backside of the wafer. The mounter is configured to attach a ring to the wafer. The mounter is configured to remove a protection film from the wafer. The dock configured to dock the mounter with the grinder.