18627687. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung Hyun Baik of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18627687 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a package substrate. A ceramic electronic component is electrically connected to the package substrate. The ceramic electronic component includes a main body having a main body upper surface and a first electrode disposed on a first side of the main body. The first side of the main body includes a first upper area disposed on the main body upper surface. A second electrode is disposed on an opposite second side of the main body. The second side of the main body includes a second upper area disposed on the main body upper surface. The second upper area is spaced apart from the first upper area. A protection unit is disposed on the main body upper surface and is positioned between the first and second upper areas. A mold unit seals the ceramic electronic component and the protection unit.