SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Lee Francis of Milton Keynes (GB)

William Jarvis of Milton Keynes (GB)

Takayuki Tange of Milton Keynes (GB)

Shouhei Hirose of Milton Keynes (GB)

SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18626578 titled 'SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE

The abstract describes a magnetic-component module consisting of a substrate, a core, a spacer, a winding, traces, and an overmold material.

The module includes a core on a first surface of the substrate, with a spacer on the core and a gap between the core and the substrate.
A winding with wire bonds extends over the core, electrically connecting different portions of the substrate.
Traces on and/or in the substrate provide additional electrical connections.
An overmold material encapsulates the core, spacer, and wire bonds, filling the gap for protection and stability.

Potential Applications: - Power electronics - Electric vehicles - Renewable energy systems

Problems Solved: - Improved electrical connections - Enhanced durability and protection - Space-saving design

Benefits: - Increased efficiency - Enhanced reliability - Compact and robust construction

Commercial Applications: Title: "Advanced Magnetic-Component Module for Power Electronics" This technology can be utilized in various industries such as automotive, renewable energy, and telecommunications for improved performance and reliability.

Questions about the technology: 1. How does the overmold material enhance the durability of the magnetic-component module?

  The overmold material provides protection against environmental factors and mechanical stress, ensuring long-term reliability.

2. What are the advantages of having traces on and/or in the substrate of the module?

  Traces enable additional electrical connections and contribute to a more compact design, optimizing space utilization.

Original Abstract Submitted

A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.