18615365. CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS (Tokyo Electron Limited)
CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Henry Jim Fulford of Marianna FL (US)
Partha Mukhopadhyay of Oviedo FL (US)
Zuriel Caribe of Albany NY (US)
Anton Devilliers of Albany NY (US)
CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
This abstract first appeared for US patent application 18615365 titled 'CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
Original Abstract Submitted
A method includes receiving a first layout file for a first workpiece and a second layout file for a second workpiece. First layout file and second layout file are analyzed to identify contact points, which are grouped into bins. A contact point of a first bin is simulated using a simulation model. Contact point includes a first feature of the first workpiece and a second feature of the second workpiece. In response to determining that the contact point does not have desired properties, a first layout of the first feature and a second layout of the second feature are updated to determine an updated contact point. Updated contact point is simulated using the simulation model. In response to determining that the updated contact point has the desired properties, first layout file is updated to include updated first layout, and second layout file is updated to include updated second layout.
