18613664. SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC
Organization Name
Inventor(s)
WOOPOUNG Kim of San Jose CA US
SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC
This abstract first appeared for US patent application 18613664 titled 'SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC
Original Abstract Submitted
A semiconductor package may include a first redistribution line structure; a die on the first redistribution line structure; a first memory device on a first surface of the die; a second redistribution line structure on a second surface of the die opposite from the first surface; a second memory device on the second redistribution line structure; and at least one semiconductor chip on the second redistribution line structure and electrically connected to the first memory device and to the second memory device. The first memory device may be a static RAM (SRAM), and the second memory device may be a dynamic RAM (DRAM).