LIQUID EJECTING HEAD AND MANUFACTURING METHOD

Organization Name

Inventor(s)

LIQUID EJECTING HEAD AND MANUFACTURING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18611376 titled 'LIQUID EJECTING HEAD AND MANUFACTURING METHOD

Simplified Explanation: The patent application describes a method of bonding a flow channel substrate and a pressure chamber substrate in a liquid ejecting head using an adhesive. The pressure chamber substrate has openings that connect the pressure chamber space to the flow channel, with wall portions and recessed and protruding portions for efficient liquid ejection.

Key Features and Innovation:

Bonding of flow channel substrate and pressure chamber substrate in a liquid ejecting head.
Use of adhesive for bonding.
Design of pressure chamber substrate with openings connecting pressure chamber space to flow channel.
Wall portions with recessed and protruding portions for efficient liquid ejection.

Potential Applications: This technology can be applied in inkjet printers, 3D printing, and other liquid ejecting devices where precise control of liquid flow is essential.

Problems Solved:

Efficient bonding of flow channel and pressure chamber substrates.
Improved liquid ejection performance.
Enhanced control of liquid flow in liquid ejecting devices.

Benefits:

Enhanced liquid ejection performance.
Improved reliability and durability of liquid ejecting heads.
Precise control of liquid flow for high-quality printing.

Commercial Applications: This technology can be utilized in the manufacturing of inkjet printers, 3D printers, and other liquid ejecting devices, improving their performance and reliability in various industries.

Questions about Liquid Ejecting Head Technology: 1. How does the design of the pressure chamber substrate impact the efficiency of liquid ejection? 2. What are the potential applications of this technology beyond inkjet printers and 3D printing?

Frequently Updated Research: Stay updated on advancements in adhesive technologies for bonding substrates in liquid ejecting heads to enhance performance and reliability.

Original Abstract Submitted

In a liquid ejecting head, a flow channel substrate and a pressure chamber substrate are bonded by an adhesive. The pressure chamber substrate includes a first opening formed exposing at least a portion of a diaphragm to a pressure chamber space, a second opening coupling the pressure chamber space to a flow channel formed in the flow channel substrate, at least one wall portion being an inner wall portion partitioning the pressure chamber space and coupling the first opening to the second opening, at least one recess portion formed on the wall portion and recessed in a first direction from the flow channel substrate to the diaphragm, and at least one protruding portion formed on the wall portion and protruding in a direction opposite to the first direction, the protruding portion being disposed between the at least one recess portion and the first opening in a longitudinal direction.