18608018. ELECTRONIC COMPONENT AND FILM FORMING METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
ELECTRONIC COMPONENT AND FILM FORMING METHOD
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Tomoya Ooshima of Nagaokakyo-shi (JP)
Yuuta Hoshino of Nagaokakyo-shi (JP)
ELECTRONIC COMPONENT AND FILM FORMING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18608018 titled 'ELECTRONIC COMPONENT AND FILM FORMING METHOD
Simplified Explanation: The patent application describes an electronic component with a base body that has a recessed outer surface covered by a glass film, where the thickness of the glass film varies within the recess.
Key Features and Innovation:
- Electronic component with a base body and recessed outer surface.
- Glass film covering the recessed area with varying thickness.
- Ratio of minimum to maximum thickness of the glass film is between 0.05 to 0.8.
Potential Applications: This technology could be used in various electronic devices such as smartphones, tablets, and laptops where a protective glass film is required.
Problems Solved: This technology addresses the need for a protective covering on electronic components that can adapt to different surface levels.
Benefits:
- Enhanced protection for electronic components.
- Improved aesthetics with a seamless glass film covering.
- Customizable thickness for different levels of protection.
Commercial Applications: Potential commercial applications include the consumer electronics industry, specifically in the manufacturing of smartphones, tablets, and laptops.
Prior Art: Readers can start searching for prior art related to this technology in the field of electronic component manufacturing, glass film applications, and protective coverings for devices.
Frequently Updated Research: Stay updated on advancements in glass film technology, electronic component protection, and surface covering innovations.
Questions about Glass Film Technology: 1. What are the different types of glass films used in electronic components? 2. How does the thickness of the glass film impact the durability of the electronic component?
Original Abstract Submitted
An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.