Three-Dimensional (3D) Copper in Printed Circuit Boards

Organization Name

Inventor(s)

Mark J. Beesley of Carmel Valley CA (US)

Three-Dimensional (3D) Copper in Printed Circuit Boards - A simplified explanation of the abstract

This abstract first appeared for US patent application 18601668 titled 'Three-Dimensional (3D) Copper in Printed Circuit Boards

Simplified Explanation: The patent application discloses structures in printed circuit boards (PCBs) that implement three-dimensional (3D) conductive material, such as copper, through trenches and/or buried vias filled with conductive material.

Key Features and Innovation:

Implementation of 3D conductive material in PCBs through trenches and buried vias.
Trenches formed in build-up layers by overlapping laser drilled vias and filled with conductive material using electroplating.
Buried vias formed through core layers by mechanical drilling and filled with solid conductive material using electroless and electrolytic plating.
Various PCB structures utilizing combinations of trenches and buried vias filled with conductive material.

Potential Applications: The technology can be applied in various electronic devices and systems that require efficient and reliable PCBs with 3D conductive material.

Problems Solved: This technology addresses the need for improved conductivity and signal transmission in PCBs, especially in complex electronic devices with high-density circuitry.

Benefits:

Enhanced conductivity and signal transmission in PCBs.
Improved reliability and efficiency in electronic devices.
Enables the design of more compact and high-performance electronic systems.

Commercial Applications: The technology can be utilized in the manufacturing of advanced electronic devices, telecommunications equipment, aerospace systems, and other high-tech industries.

Questions about 3D Conductive Material in PCBs: 1. How does the technology of implementing 3D conductive material in PCBs improve signal transmission? 2. What are the potential cost implications of using this innovative PCB technology?

Frequently Updated Research: Ongoing research in the field of PCB design and manufacturing may lead to further advancements in implementing 3D conductive material for improved performance and reliability in electronic devices.

Original Abstract Submitted

Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.