CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

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CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

This abstract first appeared for US patent application 18588729 titled 'CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

Original Abstract Submitted

A circuit board include: a substrate having a first surface including a first region and a second region; a connection pad disposed in the first region and having a first height in a direction perpendicular to the first surface; a circuit wiring disposed in the second region, including different metal films, and having a second height in the direction perpendicular to the first surface to be greater than the first height; and an insulating pattern layer covering the circuit wiring in the second region and protruding from the first surface to have a step from the first region.