APPARATUS FOR COOLING

Organization Name

Nokia Technologies Oy

Inventor(s)

Raffaele Luca Amalfi of Murray Hill NJ (US)

Stefano Grillanda of Murray Hill NJ (US)

Ryan Enright of Murray Hill NJ (US)

Cristian Bolle of Murray Hill NJ (US)

Mark Earnshaw of Murray Hill NJ (US)

APPARATUS FOR COOLING

This abstract first appeared for US patent application 18580789 titled 'APPARATUS FOR COOLING

Original Abstract Submitted

Examples of the disclosure relate to apparatus for cooling components such as electronic circuitry components and photonic components. A first component and a second component are provided on the same surface of a substrate. At least one temperature control means, such as a thermoelectric cooler. is configured to control the temperature of at least one of the components. The apparatus also comprises a plurality of heat transfer means that extend through the substrate from the first surface to the second surface. The plurality of heat transfer means enable heat to be transferred from the components to a heat pipe provided on the second surface of the substrate. This enables heat to be transferred through the substrate and away from the components and so can reduce the amount of heat that spreads laterally across the substrate. This allows for efficient removal of heat from the components and reduces heat transfer between the components.