SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Organization Name

Inventor(s)

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18579056 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Simplified Explanation: The patent application describes a process involving emitting P-polarized infrared light onto a substrate at specific incident angles, measuring the light transmitted or reflected from the substrate, performing substrate processing, and then repeating the measuring process to extract a difference spectrum.

In the first measuring process, P-polarized infrared light is emitted onto the substrate at an incident angle where the interference signal is smaller than the change caused by light absorption by the substrate.
Substrate processing is then performed on the substrate after the first measuring process.
In the second measuring process, P-polarized infrared light is emitted onto the substrate at a different incident angle after substrate processing.
The difference spectrum between the transmitted or reflected light measured in the first and second measuring processes is extracted in an extraction process.

Key Features and Innovation:

Utilizes P-polarized infrared light for measuring processes.
Measures light transmitted or reflected from a substrate.
Performs substrate processing between measuring processes.
Extracts a difference spectrum to analyze changes in the substrate.

Potential Applications:

Quality control in manufacturing processes.
Material analysis and characterization.
Surface inspection and monitoring.

Problems Solved:

Ensures accurate measurement of substrate properties.
Facilitates analysis of changes in the substrate after processing.
Improves understanding of material behavior under different conditions.

Benefits:

Enhanced process control and optimization.
Increased efficiency in substrate processing.
Improved product quality and consistency.

Commercial Applications: Potential commercial applications include:

Semiconductor manufacturing.
Thin film deposition processes.
Coating and surface treatment industries.

Questions about the Technology: 1. How does the use of P-polarized infrared light improve the accuracy of substrate measurements? 2. What are the specific parameters that need to be controlled during the measuring and processing stages for optimal results?

Original Abstract Submitted

In a first measuring process, P-polarized infrared light is emitted onto a substrate at a first incident angle at which an interference signal becomes smaller than a change by light absorption by the substrate, and light transmitted through or reflected from the substrate is measured. In a substrate processing process, substrate processing is performed on the substrate after the first measuring process. In a second measuring process, after substrate processing, P-polarized infrared light is emitted onto the substrate at a second incident angle at which an interference signal becomes smaller than a change caused by light absorption by the substrate, and light transmitted through or reflected from the substrate is measured. In an extraction process, a difference spectrum between the spectrum of the transmitted light or reflected light measured in the first measuring process and the transmitted light or reflected light measured in the second measuring process is extracted.