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18578439. SPEAKER MODULE AND ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)

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SPEAKER MODULE AND ELECTRONIC DEVICE

Organization Name

HONOR DEVICE CO., LTD.

Inventor(s)

Zhihao Guo of Shenzhen (CN)

Hao Zhang of Shenzhen (CN)

SPEAKER MODULE AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18578439 titled 'SPEAKER MODULE AND ELECTRONIC DEVICE

The patent application describes a speaker module for an electronic device, which includes a shell, a vibration assembly, and a damping film. The vibration assembly is mounted inside the shell, dividing it into a front cavity and a back cavity. The shell has a through hole that connects the front and back cavities, and the damping film covers the through hole with a lower elastic modulus than the vibration assembly.

  • Speaker module for electronic devices
  • Shell, vibration assembly, and damping film components
  • Vibration assembly divides shell into front and back cavities
  • Damping film with lower elastic modulus than vibration assembly
  • Through hole in shell connecting front and back cavities

Potential Applications: - Consumer electronics - Audio devices - Automotive sound systems

Problems Solved: - Improved sound quality - Enhanced vibration control - Reduced distortion

Benefits: - Clearer audio output - Better overall sound performance - Increased durability of speaker module

Commercial Applications: Title: Innovative Speaker Module for Enhanced Audio Devices This technology can be used in various consumer electronics, audio devices, and automotive sound systems to improve sound quality and overall performance.

Questions about the technology: 1. How does the damping film contribute to the performance of the speaker module? The damping film helps control vibrations and reduce distortion in the audio output, resulting in clearer sound quality.

2. What are the advantages of having a through hole in the shell of the speaker module? The through hole allows for better airflow and pressure equalization between the front and back cavities, enhancing the overall performance of the speaker module.


Original Abstract Submitted

This application provides a speaker module and an electronic device, and the electronic device includes a speaker module. The speaker module includes a shell, a vibration assembly, and a damping film, where the vibration assembly is mounted in an inner portion of the shell, the vibration assembly divides the inner portion of the shell into a front cavity and a back cavity, the shell is provided with a through hole, the through hole is communicated with the front cavity and the back cavity, and the damping film is mounted in the inner portion of the shell and covers the through hole, where an elastic modulus of the damping film is less than an elastic modulus of the vibration assembly.

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