INSULATION MODULE

Organization Name

Inventor(s)

INSULATION MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18537258 titled 'INSULATION MODULE

Simplified Explanation

The insulation module described in the patent application includes a light-emitting element, a light-receiving element, die pads for mounting the elements, a transparent resin covering the elements, a reflection member that reflects light, and an encapsulation resin with a light-blocking effect.

The insulation module consists of a light-emitting element and a light-receiving element mounted on separate die pads.
Both elements are covered by a transparent resin, and a reflection member made of a light-reflecting material covers the transparent resin.
An encapsulation resin encapsulates the reflection member and transparent resin, made from a material with a light-blocking effect.
Inorganic particles that absorb or reflect light from the light-emitting element are included in either the reflection member or the transparent resin.

Potential Applications

The technology described in the patent application could be applied in various fields such as automotive lighting, display technology, and optical communication systems.

Problems Solved

This technology solves the problem of efficiently transferring light between elements while providing insulation and protection from external factors.

Benefits

The benefits of this technology include improved light transmission efficiency, enhanced durability, and protection for the light-emitting and light-receiving elements.

Potential Commercial Applications

The technology could be commercially applied in industries such as automotive manufacturing, consumer electronics, and telecommunications under the title "Innovative Insulation Module for Optoelectronic Devices."

Possible Prior Art

One possible prior art for this technology could be similar insulation modules used in optoelectronic devices, but without the specific combination of elements and materials described in this patent application.

Unanswered Questions

How does this technology compare to existing insulation modules in terms of efficiency and durability?

The article does not provide a direct comparison with existing insulation modules in terms of efficiency and durability.

What are the potential challenges in implementing this technology on a large scale for commercial applications?

The article does not address the potential challenges in implementing this technology on a large scale for commercial applications.

Original Abstract Submitted

An insulation module includes: a light-emitting element; a light-receiving element that receives light from the light-emitting element; a first die pad on which the light-emitting element is mounted; a second die pad that is provided in alignment with the first die pad and on which the light-receiving element is mounted; a transparent resin that at least covers both the light-emitting element and the light-receiving element; a reflection member that covers at least the transparent resin and is formed from a material that reflects light from the light-emitting element; and an encapsulation resin that encapsulates the reflection member as well as the transparent resin and is formed from a material having a light-blocking effect. At least one of the reflection member and the transparent resin includes inorganic particles that absorb or reflect light from the light-emitting element.