18521651. POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING THE SAME (KIA CORPORATION)
POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING THE SAME
Organization Name
Inventor(s)
Hyeong Won Park of Hwaseong-si (KR)
Seong Won Seo of Gimcheon-si (KR)
POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING THE SAME
This abstract first appeared for US patent application 18521651 titled 'POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING THE SAME
Original Abstract Submitted
Disclosed is a polypropylene resin composition that improves chemical stability against external factors because it prevents deterioration of physical properties by moisture and has low surface energy. Disclosed is also a molded article including the polypropylene resin composition that has low ion elution, which is the most important requirement, and can achieve excellent weight reduction.