18520724. CONDUCTIVE PASTE AND GLASS ARTICLE simplified abstract (Murata Manufacturing Co., Ltd.)

CONDUCTIVE PASTE AND GLASS ARTICLE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Seitaro Washizuka of Nagaokakyo-shi (JP)

CONDUCTIVE PASTE AND GLASS ARTICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18520724 titled 'CONDUCTIVE PASTE AND GLASS ARTICLE

Simplified Explanation

The conductive paste described in the patent application contains a conductive powder, a glass frit, an organic vehicle, and a silicon resinate sintering retardant. The content of the silicon resinate sintering retardant is 0.005 wt % or more in terms of metal based on 100 wt % of the conductive powder.

• Conductive paste composition:

 - Conductive powder
 - Glass frit
 - Organic vehicle
 - Silicon resinate sintering retardant (0.005 wt % or more)

• The silicon resinate sintering retardant helps in controlling the sintering process of the conductive paste.
• The composition is optimized for specific applications where controlled sintering is required.

Potential Applications

The technology can be applied in:

• Electronics manufacturing
• Printed circuit board production
• Solar cell fabrication

Problems Solved

• Improved control over sintering process
• Enhanced conductivity of the paste
• Better adhesion to substrates

Benefits

• Increased efficiency in manufacturing processes
• Higher quality end products
• Cost-effective solution

Potential Commercial Applications

Optimizing Conductive Paste Composition for Enhanced Sintering Control

Possible Prior Art

No prior art known at this time.

Unanswered Questions

How does the silicon resinate sintering retardant affect the overall performance of the conductive paste?

The exact mechanism of action of the silicon resinate sintering retardant in the conductive paste is not detailed in the abstract. Further research may be needed to understand its impact on the paste's properties.

Are there any limitations to the use of this conductive paste in certain applications?

The abstract does not mention any potential limitations or drawbacks of using this conductive paste. Additional studies or testing may be required to identify any restrictions on its application.

Original Abstract Submitted

A conductive paste containing: a conductive powder; a glass frit; an organic vehicle; and a silicon resonate sintering retardant, and a content of the silicon resinate sintering retardant is 0.005 wt % or more in terms of metal based on 100 wt % of the conductive powder.