18518416. SEMICONDUCTOR PACKAGE STRUCTURES (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)

SEMICONDUCTOR PACKAGE STRUCTURES

Organization Name

YANGTZE MEMORY TECHNOLOGIES CO., LTD.

Inventor(s)

Daiyu Li of Wuhan CN

Mingkang Zhang of Wuhan CN

Chengbao Zhou of Wuhan CN

Min Wen of Wuhan CN

Zhen Pan of Wuhan CN

Shu Wu of Wuhan CN

SEMICONDUCTOR PACKAGE STRUCTURES

This abstract first appeared for US patent application 18518416 titled 'SEMICONDUCTOR PACKAGE STRUCTURES

Original Abstract Submitted

In some aspects, a package structure includes a substrate and semiconductor devices stacked over the substrate. The semiconductor devices are stacked along a first direction, and at least one of the semiconductor devices comprises one or more pads located on a side surface of the at least one of the semiconductor devices.