18504158. BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS (Taiwan Semiconductor Manufacturing Company, Ltd.)
BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yung-Chi Lin of New Taipei City TW
Yan-Zuo Tsai of Hsinchu City TW
Yang-Chih Hsueh of Hsinchu City TW
BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
This abstract first appeared for US patent application 18504158 titled 'BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
Original Abstract Submitted
A bonding tool for bonding semiconductor dies to a semiconductor wafer is provided. The bonding tool includes a wafer chuck, an edge support, a hard plate, and a buffer layer. The wafer chuck carries the semiconductor wafer and the semiconductor dies placed on the semiconductor wafer. The edge support is disposed on the wafer chuck, the semiconductor wafer and the semiconductor dies are laterally surrounded by the edge support, and a top surface of the edge support substantially levels with surfaces of the semiconductor dies. The hard plate is movably disposed over the semiconductor dies, the edge support and the wafer chuck. The buffer layer is disposed on a bottom surface of the hard plate, and the buffer layer is in contact with the top surface of the edge support and the semiconductor dies when the hard plate moves towards the edge support.