DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

Organization Name

Inventor(s)

Jeffrey Salvacion Solas of Iloilo City PH

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

This abstract first appeared for US patent application 18498144 titled 'DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

Original Abstract Submitted

A package comprises a semiconductor die including a device side having circuitry formed therein and a first metal member on the device side of the die and having a top surface facing away from the die. The first metal member includes a group of dielectric members, each dielectric member in the group of dielectric members extending at least partially through a thickness of the first metal member. The package also comprises solder material contacting the top surface of the first metal member and top surfaces of the dielectric members in the group of dielectric members. The package also includes a second metal member coupled to the solder material and to a conductive terminal of the package, the conductive terminal exposed to an exterior of the package.