18485602. GATE FORMATION PROCESS (Taiwan Semiconductor Manufacturing Co., Ltd.)
GATE FORMATION PROCESS
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ming-Huei Lin of Hsinchu City TW
Kai-Yuan Cheng of Hsinchu County TW
Chih-Pin Tsao of Hsinchu County TW
Hsing-Kan Peng of Hsinchu County TW
Shu-Hui Wang of Hsinchu City TW
Jeng-Ya Yeh of New Taipei City TW
GATE FORMATION PROCESS
This abstract first appeared for US patent application 18485602 titled 'GATE FORMATION PROCESS
Original Abstract Submitted
Methods for forming a gate structure of a multi-gate device are provided. An example method includes depositing a gate dielectric layer over first nanostructures over a first region of a substrate and second nanostructures over a second region of the substrate, depositing a first work function metal (WFM) layer over the first nanostructures and the second nanostructures, depositing a first hard mask (HM) layer over the first WFM layer, selectively removing the first HM layer and the first WFM layer over the first region, selectively removing the first HM layer over the second region, depositing a second WFM layer over the substrate, depositing a second HM layer over the second WFM layer, selectively removing the second HM layer and the second WFM layer over the first region, selectively removing the second HM layer over the second region, and depositing a third WFM layer over the substrate.
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Huei Lin of Hsinchu City TW
- Kai-Yuan Cheng of Hsinchu County TW
- Chih-Pin Tsao of Hsinchu County TW
- Hsing-Kan Peng of Hsinchu County TW
- Shih-Hsun Chang of Hsinchu TW
- Shu-Hui Wang of Hsinchu City TW
- Jeng-Ya Yeh of New Taipei City TW
- H01L29/06
- H01L21/8234
- H01L27/088
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H10D62/118