18483957. ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER (Applied Materials, Inc.)
ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
Organization Name
Inventor(s)
Paul R. Mchugh of Kalispell MT US
Gregory J. Wilson of Kalispell MT US
Kyle M. Hanson of Kalispell MT US
Nolan L. Zimmerman of Kalispell MT US
Randy A. Harris of Kalispell MT US
John L. Klocke of Kalispell MT US
Eric J. Bergman of Kalispell MT US
Keith Edward Ypma of Kalispell MT US
ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
This abstract first appeared for US patent application 18483957 titled 'ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
Original Abstract Submitted
Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.
- Applied Materials, Inc.
- Paul R. Mchugh of Kalispell MT US
- Gregory J. Wilson of Kalispell MT US
- Kyle M. Hanson of Kalispell MT US
- Nolan L. Zimmerman of Kalispell MT US
- Randy A. Harris of Kalispell MT US
- John L. Klocke of Kalispell MT US
- Eric J. Bergman of Kalispell MT US
- Keith Edward Ypma of Kalispell MT US
- C25D21/10
- C25D7/12
- C25D17/00
- CPC C25D21/10
