18480068. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chun Yi Chou of Hsinchu City TW
Guan-Lin Chen of Hsinchu County TW
Shi Ning Ju of Hsinchu City TW
Kuo-Cheng Chiang of Hsinchu County TW
Chih-Hao Wang of Hsinchu County TW
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 18480068 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
A method includes forming semiconductive sheets over a substrate and arranged in a vertical direction; forming source/drain regions on either side of each of the semiconductive sheets; forming first air gap inner spacers interleaving with the semiconductive sheets; forming a gate around each of the semiconductive sheets, wherein the first air gap inner spacers are laterally between the gate and a first one of the source/drain regions.
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Yi Chou of Hsinchu City TW
- Guan-Lin Chen of Hsinchu County TW
- Shi Ning Ju of Hsinchu City TW
- Kuo-Cheng Chiang of Hsinchu County TW
- Chih-Hao Wang of Hsinchu County TW
- H01L29/423
- H01L21/8234
- H01L27/088
- H01L29/06
- H01L29/08
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H10D30/6735