18476991. SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS (Advanced Micro Devices, Inc.)
SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
Organization Name
Inventor(s)
Sriram Chandrasekaran of Austin TX US
Hemanth Kumar Dhavaleswarapu of Austin TX US
Robert Grant Spurney of Austin TX US
SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
This abstract first appeared for US patent application 18476991 titled 'SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
Original Abstract Submitted
A method can include embedding one or more thermal sources in a semiconductor package substrate and positioning one or more substrate buildup layers above the one or more thermal sources. The method can also include forming one or more thermal vias in the one or more substrate buildup layers. Various other methods and systems are also disclosed.
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