18471854. METHOD FOR SEMICONDUCTOR PROCESSING (Tokyo Electron Limited)
METHOD FOR SEMICONDUCTOR PROCESSING
Organization Name
Inventor(s)
Kandabara Tapily of Albany NY US
Tek Po Rinus Lee of Albany NY US
METHOD FOR SEMICONDUCTOR PROCESSING
This abstract first appeared for US patent application 18471854 titled 'METHOD FOR SEMICONDUCTOR PROCESSING
Original Abstract Submitted
A method for semiconductor processing includes forming a first film over a first region of a substrate. A second region of the substrate remains substantially free of the first film. The second region is adjacent to the first region. The method further includes performing a plasma treatment over the substrate and selectively depositing a second film over the first film. The first film blocks radicals from the first region during the plasma treatment. The second region of the substrate remains substantially free of the second film.