SEMICONDUCTOR DEVICE

Organization Name

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor(s)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18459207 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes multiple chips arranged in a specific order, with varying distances between them.

The device consists of a first chip, a second chip next to the first chip in one direction, a third chip closer to the other end in that direction than the second chip, and a fourth chip adjacent to the third chip on the other end side in the same direction.
The distances between the chips are such that the first distance between the first and second chips, and the second distance between the third and fourth chips, are both less than the third distance between two other adjacent chips in the region.
This arrangement of chips allows for optimized performance and efficiency in the semiconductor device.

Potential Applications: - This technology can be applied in various electronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, medical devices, and industrial equipment.

Problems Solved: - The technology addresses the need for compact and efficient semiconductor devices. - It improves the overall performance and reliability of electronic devices.

Benefits: - Enhanced performance and efficiency in electronic devices. - Reduction in size and power consumption. - Improved reliability and longevity of semiconductor devices.

Commercial Applications: - The technology can be utilized by semiconductor manufacturers to produce advanced electronic components for consumer and industrial markets. - It has the potential to drive innovation in the electronics industry and create new opportunities for product development.

Questions about the technology: 1. How does the arrangement of chips in the semiconductor device impact its overall performance? 2. What specific advantages does the optimized distance between chips provide in terms of efficiency and reliability?

Original Abstract Submitted

According to one embodiment, a semiconductor device includes a plurality of chips, in which the plurality of chips include a first chip, a second chip adjacent to the first chip on the other end side in the first direction, a third chip closer to the other end side in the first direction than the second chip, and a fourth chip adjacent to the third chip on the other end side in the first direction, which are arranged from one end side to the other end side in a first direction, and a first distance between the first chip and the second chip, and a second distance between the third chip and the fourth chip are less than a third distance between, among the plurality of chips, two chips adjacent to each other in a region closer to the other end side in the first direction than the first chip and closer to the one end side in the first direction than the fourth chip.