18455314. FLOW STABILITY CONTROL IN DRYING LIQUID BETWEEN PLATES (Tokyo Electron Limited)
FLOW STABILITY CONTROL IN DRYING LIQUID BETWEEN PLATES
Organization Name
Inventor(s)
Derek Bassett of Austin TX (US)
Rencheng Dong of Austin TX (US)
FLOW STABILITY CONTROL IN DRYING LIQUID BETWEEN PLATES
This abstract first appeared for US patent application 18455314 titled 'FLOW STABILITY CONTROL IN DRYING LIQUID BETWEEN PLATES
Original Abstract Submitted
A method of flow control is provided. The method includes injecting a liquid onto a wafer via a dispense system. The dispense system includes a plate and an injection hole in the plate. The plate is positioned away from the wafer at a distance and has a diameter equal to or larger than the wafer. A drying gas is injected onto the wafer via the dispense system to push out the liquid. While injecting the drying gas onto the wafer via the dispense system, at least one parameter selected from the group consisting of an inlet flow pressure of the injection hole, the distance and an injection sequence is adjusted so that an interface between the drying gas and the liquid is stable.