HEAD UNIT AND LIQUID DISCHARGE APPARATUS

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HEAD UNIT AND LIQUID DISCHARGE APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18441460 titled 'HEAD UNIT AND LIQUID DISCHARGE APPARATUS

The abstract describes a patent application for a system involving two flexible wiring substrates, drive circuits, heat radiation members, and heat transfer members.

The first flexible wiring substrate is connected to the first head side terminal of the first head and has a first drive circuit.
The second flexible wiring substrate is connected to the second head side terminal of the first head and has a second drive circuit.
A first heat radiation member is thermally coupled to the second drive circuit but not to the first drive circuit.
A first heat transfer member is thermally coupled to the first drive circuit and the first heat radiation member to transfer heat generated by the first drive circuit.

Potential Applications: - This technology could be used in electronic devices that require efficient heat dissipation. - It may find applications in automotive systems where thermal management is crucial.

Problems Solved: - Addresses the issue of heat generation in electronic components. - Improves overall system reliability by managing heat effectively.

Benefits: - Enhanced thermal performance of electronic systems. - Increased longevity of electronic components. - Improved overall system efficiency.

Commercial Applications: Title: Advanced Thermal Management System for Electronics This technology could be utilized in smartphones, laptops, electric vehicles, and industrial machinery to improve thermal management and enhance performance.

Questions about the technology: 1. How does this system compare to traditional heat dissipation methods? 2. What are the potential cost implications of implementing this technology in electronic devices?

Frequently Updated Research: Stay updated on the latest advancements in thermal management systems for electronic devices to ensure optimal performance and efficiency.

Original Abstract Submitted

a first flexible wiring substrate having one end coupled to a first head side terminal of the first head, drawn out from one side of the first head in the first direction, and provided with a first drive circuit, a second flexible wiring substrate having one end coupled to the second head side terminal of the first head, drawn out from the other side of the first head in the first direction, and provided with a second drive circuit, a first heat radiation member thermally coupled to the second drive circuit, and not thermally coupled to the first drive circuit, and a first heat transfer member thermally coupled to the first drive circuit and the first heat radiation member, and transferring heat generated by the first drive circuit to the first heat radiation member.