RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Takashi Yamada of Nagaokakyo-shi (JP)

Kiyoshi Aikawa of Nagaokakyo-shi (JP)

Motoji Tsuda of Nagaokakyo-shi (JP)

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18437360 titled 'RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Simplified Explanation

The radio-frequency module described in the patent application includes a module substrate with electronic components, external connection terminals, a resin member, and electrodes. The components are arranged on the major surfaces of the substrate, with external connection terminals and electrodes also present on the major surfaces. A passive component is included among the electronic components, with at least a portion of an external connection terminal overlapping the passive component.

Module substrate with electronic components, external connection terminals, resin member, and electrodes
Passive component included among electronic components
External connection terminal overlaps passive component

Potential Applications

The technology described in the patent application could be applied in various industries such as telecommunications, consumer electronics, and automotive for the development of radio-frequency modules with improved performance and reliability.

Problems Solved

This technology solves the problem of efficiently integrating electronic components, external connection terminals, and passive components in a radio-frequency module while ensuring proper functionality and connectivity.

Benefits

The benefits of this technology include enhanced performance, increased reliability, and simplified manufacturing processes for radio-frequency modules.

Potential Commercial Applications

"Enhanced Radio-Frequency Module Technology for Telecommunications and Consumer Electronics"

Possible Prior Art

There may be prior art related to the integration of electronic components and passive components in radio-frequency modules, but specific examples are not provided in the patent application.

Unanswered Questions

How does this technology compare to existing radio-frequency module designs in terms of size and performance?

The patent application does not provide a direct comparison with existing radio-frequency module designs, so it is unclear how this technology stacks up against current solutions.

What specific industries or applications could benefit the most from this technology?

While the potential applications are mentioned broadly, it is not specified which industries or applications could see the most significant advantages from implementing this technology.

Original Abstract Submitted

A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.