FILM FORMING METHOD FOR METAL FILM

Organization Name

TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor(s)

Koji Inagaki of Toyota-shi (JP)

Jyunya Murai of Nisshin-shi (JP)

Jun Yoshitomi of Toyota-shi (JP)

Yoji Sato of Kasugai-shi (JP)

Osamu Yamashita of Toyota-shi (JP)

Hiromichi Nakata of Toyota-shi (JP)

Masaaki Nishiyama of Komaki-shi (JP)

FILM FORMING METHOD FOR METAL FILM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18432533 titled 'FILM FORMING METHOD FOR METAL FILM

The patent application describes a method for forming a metal film on a substrate using a plating solution and an electrolyte membrane.

The metal film is formed by bringing the plating solution into contact with the substrate material through the electrolyte membrane.
The electrolyte membrane is then separated from the substrate material by moving either the mounting table or a container in a direction away from each other.
The plating solution is circulated through a path outside the container before or during the film forming step.
The circulation path is blocked and the plating solution in the container is sealed before the separating step.

Potential Applications: - This method can be used in the manufacturing of electronic components that require precise metal film deposition. - It can also be applied in the production of sensors, solar cells, and other devices that utilize metal films.

Problems Solved: - Provides a controlled and efficient way to form metal films on substrates. - Ensures uniformity and quality in the deposition process.

Benefits: - Improved accuracy and consistency in metal film formation. - Cost-effective and environmentally friendly process. - Enhanced productivity and reduced waste in manufacturing.

Commercial Applications: Metal film deposition technology can be utilized in industries such as electronics, semiconductors, automotive, and aerospace for various applications requiring precise metal coatings.

Questions about Metal Film Forming Method: 1. How does the separation of the electrolyte membrane from the substrate material contribute to the quality of the metal film deposition? 2. What are the advantages of circulating the plating solution outside the container before or during the film forming step?

Original Abstract Submitted

A film forming method for a metal film includes steps of, after a substrate material is mounted on a mounting table, forming the metal film on a surface of the substrate material with a plating solution brought into contact with the substrate material through an electrolyte membrane, and with the plating solution sealed, separating the electrolyte membrane from the substrate material by moving at least one of the mounting table and a container in a direction away from the other. The plating solution contained in the container is circulated through a circulation path outside the container, before or during the film forming step. A circulation path is blocked and the plating solution in the container is sealed, before this separating step.