18431869. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
This abstract first appeared for US patent application 18431869 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Original Abstract Submitted
A semiconductor package includes a substrate, a dielectric structure disposed on the substrate, a via structure that penetrates the substrate and the dielectric structure, and a pad structure that is in contact with the via structure. The dielectric structure includes a first part and a second part disposed on the first part. The second part of the dielectric structure is disposed between the via structure and the pad structure. A top surface of the second part of the dielectric structure is coplanar with a top surface of the via structure.