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18427998. METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents

METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Yun Hwi Park of Yongin-si KR

Jin Yeol Wang of Yongin-si KR

Yong Seok Choi of Yongin-si KR

Ji Ho Uh of Hwaseong-si KR

Seung Min Ryu of Hwaseong-si KR

Do Youn Kim of Hwaseong-si KR

Yoon Ho Jung of Hwaseong-si KR

METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK

This abstract first appeared for US patent application 18427998 titled 'METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK

Original Abstract Submitted

The present invention relates to a method for manufacturing an electrostatic chuck, and more specifically, to a method for manufacturing an electrostatic chuck with minimized temperature deviation. The method of the present invention includes: a step S of forming a metal layer by depositing metal on a lower portion of a base containing a ceramic material and provided with an ESC electrode at an upper portion thereof; and a step S of forming a heater electrode by forming a pattern on the metal layer using a photolithography process.

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