18415023. Integrated Assemblies simplified abstract (Micron Technology, Inc.)
Integrated Assemblies
Organization Name
Inventor(s)
Beau D. Barry of Boise ID (US)
Integrated Assemblies - A simplified explanation of the abstract
This abstract first appeared for US patent application 18415023 titled 'Integrated Assemblies
Simplified Explanation
The integrated assembly described in the patent application includes a memory array positioned over a base, with first sense amplifier circuitry located directly under the memory array. Vertically-extending digit lines are associated with the memory array and are connected to the first sense amplifier circuitry. Second sense amplifier circuitry is offset from the first sense amplifier circuitry on the base. Control circuitry is designed to selectively connect the digit lines to either a voltage supply terminal or to the second sense amplifier circuitry.
- Memory array positioned over a base
- First sense amplifier circuitry located directly under the memory array
- Vertically-extending digit lines associated with the memory array
- Second sense amplifier circuitry offset from the first sense amplifier circuitry
- Control circuitry selectively connects digit lines to voltage supply terminal or second sense amplifier circuitry
Potential Applications
This technology could be applied in:
- High-speed memory systems
- Data storage devices
- Integrated circuits
Problems Solved
This technology helps to:
- Improve memory access speed
- Enhance data processing efficiency
- Increase overall system performance
Benefits
The benefits of this technology include:
- Faster data retrieval
- Reduced power consumption
- Enhanced reliability and stability
Potential Commercial Applications
Optimized for SEO: "Innovative Memory Array Technology for High-Speed Data Processing" This technology could be utilized in:
- Consumer electronics
- Telecommunications equipment
- Automotive systems
Possible Prior Art
There may be prior art related to:
- Memory array configurations
- Sense amplifier circuitry designs
Unanswered Questions
How does this technology compare to existing memory array configurations in terms of speed and efficiency?
This article does not provide a direct comparison with existing technologies to evaluate the performance improvements.
What specific industries or applications would benefit the most from implementing this integrated assembly?
The article does not specify which industries or applications would see the greatest advantages from adopting this technology.
Original Abstract Submitted
Some embodiments include an integrated assembly having a memory array over a base. First sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. Vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. Second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. Control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.
