18397635. THERMAL MONITOR FOR HIGH PRESSURE PROCESSING simplified abstract (ASM IP Holding B.V.)
THERMAL MONITOR FOR HIGH PRESSURE PROCESSING
Organization Name
Inventor(s)
Sandeep Ghosh of Chander AZ (US)
Robinson James of Phoenix AZ (US)
THERMAL MONITOR FOR HIGH PRESSURE PROCESSING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18397635 titled 'THERMAL MONITOR FOR HIGH PRESSURE PROCESSING
The semiconductor processing system described in the abstract includes a precursor delivery arrangement, a chamber arrangement, and a controller. The controller is responsible for acquiring a baseline substrate thickness profile, determining temperature profiles for depositing material layers, and controlling the deposition process.
- The system includes a precursor delivery arrangement connected to a chamber arrangement.
- The controller, with a processor and memory, acquires a baseline substrate thickness profile for a selected process recipe.
- It determines a first temperature profile setting for depositing a first material layer at low pressure.
- The controller calculates a high-pressure thermal offset for the first temperature profile setting.
- It applies the high-pressure thermal offset to determine a second temperature profile setting for the deposition process.
- The system then deposits a second material layer precursor over the substrate at high pressure using the second temperature profile setting.
Potential Applications: - This technology can be used in the semiconductor industry for precise and controlled deposition of material layers. - It can also be applied in research and development settings for experimenting with different process recipes and material combinations.
Problems Solved: - The system addresses the need for accurate temperature control during the deposition process to ensure high-quality material layers. - It streamlines the process of determining temperature profiles for different materials and process recipes.
Benefits: - Improved control over the deposition process leads to higher quality semiconductor devices. - The system increases efficiency by automating the calculation of temperature profiles for different materials.
Commercial Applications: Title: Advanced Semiconductor Deposition System for Precision Manufacturing This technology can be utilized in semiconductor manufacturing facilities to enhance the quality and efficiency of material deposition processes. It can also be integrated into research and development labs for testing new materials and process recipes.
Questions about the technology: 1. How does the system ensure precise temperature control during the deposition process? 2. What are the key advantages of using high-pressure thermal offsets in semiconductor material deposition?
Original Abstract Submitted
A semiconductor processing system includes a precursor delivery arrangement, a chamber arrangement, and a controller. The chamber arrangement is connected to the precursor delivery arrangement. The controller is operatively connected to the precursor delivery arrangement and the chamber arrangement, includes a processor disposed in communication with a memory, and is responsive to instructions recorded on the memory to acquire a baseline substrate thickness profile for a selected process recipe, determine a first temperature profile setting for depositing a first material layer at low pressure for the selected process recipe, determine a high-pressure thermal offset for the first temperature profile setting, apply the high-pressure thermal offset to the first temperature profile setting to determine a second temperature profile setting, seat a first substrate on the first substrate support within the chamber arrangement and flow a second material layer precursor via the precursor delivery arrangement over the first substrate at high pressure according to the selected process recipe using the second temperature profile setting.
