18396918. CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
CHEMICAL MECHANICAL POLISHING APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396918 titled 'CHEMICAL MECHANICAL POLISHING APPARATUS
The patent application describes a chemical mechanical polishing apparatus with a turntable, CMP pad, polishing head, slurry supply unit, and temperature control unit.
- Turntable with CMP pad for polishing wafers
- Polishing head contacts wafer with CMP pad to press it
- Slurry supply unit provides slurry to the CMP pad
- Temperature control unit heats the CMP pad using heating members
- Suction port on the body of the temperature control unit to suction steam
Potential Applications: - Semiconductor manufacturing - Microelectronics industry
Problems Solved: - Efficient and precise wafer polishing - Control of temperature during polishing process
Benefits: - Improved wafer quality - Increased productivity in manufacturing processes
Commercial Applications: - Semiconductor fabrication facilities - Electronics manufacturing companies
Questions about Chemical Mechanical Polishing Apparatus: 1. How does the temperature control unit impact the polishing process? 2. What are the advantages of using a CMP pad in wafer polishing?
Frequently Updated Research: - Ongoing advancements in CMP technology for semiconductor industry applications.
Original Abstract Submitted
A chemical mechanical polishing apparatus, may include: a turntable; a CMP pad installed on an upper surface of the turntable; a polishing head disposed above the turntable and contacting a wafer with the CMP pad to press the wafer; a slurry supply unit supplying slurry to the CMP pad; and a temperature control unit disposed between the slurry supply unit and the polishing head, wherein the temperature control unit may be provided with a body disposed above the CMP pad; and heating members disposed on a bottom surface of the body to heat the CMP pad, wherein the body may be provided with a suction port disposed between the heating members to suction steam.
