ELECTROLESS PLATING WITH A FLOATING POTENTIAL

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ELECTROLESS PLATING WITH A FLOATING POTENTIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18396003 titled 'ELECTROLESS PLATING WITH A FLOATING POTENTIAL

Simplified Explanation: The patent application describes methods of plating that involve applying a floating potential to a plating bath in a plating chamber, contacting a patterned substrate with the plating bath, and plating a diffusion layer on the contact surface of a metal interconnect.

The method involves applying a floating potential to a plating bath in a plating chamber.
A patterned substrate with a metal interconnect is contacted with the plating bath.
The metal interconnect is made of a first metal with a certain reduction potential.
A diffusion layer made of a second metal with a higher reduction potential is plated on the contact surface of the metal interconnect.
The plating bath includes ions of the second metal and a grain refining compound to reduce pinhole defects in the diffusion layer.

Key Features and Innovation:

Application of a floating potential to a plating bath.
Plating a diffusion layer on a metal interconnect.
Use of a second metal with a higher reduction potential for the diffusion layer.
Inclusion of ions of the second metal and a grain refining compound in the plating bath.

Potential Applications: This technology could be applied in the semiconductor industry for the fabrication of integrated circuits and other electronic devices.

Problems Solved:

Reduction of pinhole defects in diffusion layers.
Improvement of the plating process for metal interconnects.

Benefits:

Enhanced quality of diffusion layers.
Increased reliability of electronic devices.
Improved performance of integrated circuits.

Commercial Applications: Potential commercial applications include semiconductor manufacturing, electronics production, and microchip fabrication.

Questions about Plating Technology: 1. How does the use of a floating potential in the plating bath affect the plating process? 2. What are the advantages of plating a diffusion layer on a metal interconnect in semiconductor manufacturing?

Original Abstract Submitted

Exemplary methods of plating are described. The methods may include applying a floating potential to a plating bath in a plating chamber. The methods further include contacting a patterned substrate with the plating bath in the plating chamber. The patterned substrate includes at least one metal interconnect with a contact surface that is exposed to the plating bath. The metal interconnect is made of a first metal characterized by a first reduction potential. The methods further include plating a diffusion layer on the contact surface of the metal interconnect. The diffusion layer is made of a second metal characterized by a second reduction potential that is larger than the first reduction potential of the first metal in the metal interconnects. The plating bath also includes one or more ions of the second metal and a grain refining compound that reduces the formation of pinhole defects in the diffusion layer.