CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

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CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18388302 titled 'CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

The abstract of the patent application describes a circuit board with an insulating layer, a solder resist layer with openings, connection pads within the openings, and conductive layers on the connection pads with different thicknesses.

The circuit board includes an insulating layer.
A solder resist layer is placed on the insulating layer with first and second openings.
First and second connection pads are located within the first and second openings on the insulating layer.
First and second conductive layers are on the connection pads, protruding above the solder resist layer with varying thicknesses.
Each conductive layer consists of a lower conductive layer on the connection pad and an upper conductive layer on top of the lower layer.

Potential Applications: - This technology can be used in electronic devices such as smartphones, laptops, and tablets. - It can also be applied in automotive electronics, aerospace systems, and medical devices.

Problems Solved: - Provides a reliable and efficient connection between components on the circuit board. - Ensures proper insulation and protection against short circuits.

Benefits: - Improved performance and durability of electronic devices. - Enhanced reliability and stability of circuit connections.

Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Electronic Devices This technology can be utilized in the manufacturing of consumer electronics, industrial equipment, and communication devices. The market implications include increased product efficiency and reliability, leading to higher customer satisfaction and brand loyalty.

Questions about Circuit Board Technology: 1. How does the varying thickness of the conductive layers impact the performance of the circuit board? - The different thicknesses of the conductive layers allow for precise control of electrical conductivity and signal transmission, enhancing the overall functionality of the circuit board.

2. What are the specific advantages of having connection pads within openings on the insulating layer? - Placing connection pads within openings ensures proper alignment and secure attachment of components, reducing the risk of electrical interference and signal loss.

Original Abstract Submitted

A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.