18382429. AUXILIARY FLOW PLATE FOR THICKNESS AND CONCENTRATION UNIFORMITY ADJUSTABILITY (Applied Materials, Inc.)
AUXILIARY FLOW PLATE FOR THICKNESS AND CONCENTRATION UNIFORMITY ADJUSTABILITY
Organization Name
Inventor(s)
Zhepeng Cong of San Jose CA US
Alain Duboust of Sunnyvale CA US
Ala Moradian of Sunnyvale CA US
Tao Sheng of Santa Clara CA US
Nimrod Smith of Cupertino CA US
Ashur J. Atanos of San Jose CA US
AUXILIARY FLOW PLATE FOR THICKNESS AND CONCENTRATION UNIFORMITY ADJUSTABILITY
This abstract first appeared for US patent application 18382429 titled 'AUXILIARY FLOW PLATE FOR THICKNESS AND CONCENTRATION UNIFORMITY ADJUSTABILITY
Original Abstract Submitted
The present disclosure relates to an auxiliary flow plate for process kits and semiconductor processing chambers, and related methods and flow guides. In one or more embodiments, a chamber kit includes a liner, a first plate, and a second plate. The liner includes an inner face, a first ledge disposed along the inner face, and a second ledge disposed along the inner face. The second ledge is spaced from the first ledge along the inner face. The first plate is sized and shaped to be disposed within the liner on the first ledge. The second plate is sized and shaped to be disposed within the liner on the second ledge.