18381773. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Sangchul Yang of Suwon-si (KR)
Byung-Hyun Lee of Suwon-si (KR)
METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18381773 titled 'METHOD OF FABRICATING SEMICONDUCTOR DEVICE
The method described in the patent application involves fabricating a semiconductor device by first forming a target pattern on a wafer, measuring the misalignment value of the pattern, and then calculating correction values based on this misalignment.
- The method includes performing a first exposure process to create the target pattern on a wafer.
- The misalignment value of the pattern is measured to determine the accuracy of the exposure process.
- Block misalignment and pattern misalignment values are calculated based on the measured misalignment value.
- Correction values for both block and pattern misalignments are then calculated to improve the accuracy of the exposure process.
- A second exposure process is performed on a second wafer using the calculated correction values to ensure precise alignment of the patterns.
Potential Applications: - This technology can be applied in the semiconductor industry for the fabrication of advanced electronic devices. - It can be used in the production of integrated circuits and other semiconductor components that require high precision alignment.
Problems Solved: - The method addresses the issue of misalignment in semiconductor device fabrication, which can lead to reduced performance and yield.
Benefits: - Improved accuracy and precision in the fabrication of semiconductor devices. - Enhanced quality control and increased yield in semiconductor manufacturing processes.
Commercial Applications: Title: Precision Semiconductor Device Fabrication Method This technology has significant commercial applications in the semiconductor industry, particularly in the production of advanced electronic devices. Companies involved in semiconductor manufacturing can benefit from the improved accuracy and precision offered by this method, leading to higher quality products and increased efficiency in production processes.
Questions about Precision Semiconductor Device Fabrication Method: 1. How does this method improve the accuracy of semiconductor device fabrication? This method improves accuracy by measuring misalignment values and calculating correction values to ensure precise alignment of patterns during the exposure process.
2. What are the potential benefits of using this technology in semiconductor manufacturing? The potential benefits include improved quality control, increased yield, and enhanced performance of semiconductor devices.
Original Abstract Submitted
A method of fabricating a semiconductor device may include forming a target pattern on a first wafer by performing a first exposure process, measuring a misalignment value of the target pattern, calculating a block misalignment value and a pattern misalignment value based on the misalignment value, calculating a block correction value based on the block misalignment value and calculating a pattern correction value based on the pattern misalignment value, and performing a second exposure process on a second wafer, based on the block correction value and the pattern correction value.