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18381706. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Wen-Ting Lan of Hsinchu TW

Shih-Cheng Chen of Hsinchu TW

Chia-Cheng Tsai of Hsinchu TW

Kuo-Cheng Chiang of Hsinchu TW

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18381706 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

A semiconductor device includes a substrate, an active structure, a first dielectric layer and a second dielectric layer. The active structure is formed on the substrate and includes an active channel sheet, wherein the active channel sheet has a first lateral surface. The first dielectric layer is formed above the active structure and has a recess, wherein the recess is recessed with respect to the first lateral surface of the active channel sheet. The second dielectric layer is formed within the recess and has a dielectric constant, wherein the dielectric constant is less than 3.9.

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